The wafer reclaims services include various services. These companies are focusing on inorganic growth techniques and launching websites to sell their products.

Metal Stripping

A wafer reclaims service is an advanced method that can successfully strip metal and other films from IC fab wafers. The process can range from a simple "strip and clean" process to a full polish and reclaim process. Metal and photo-resistor films are removed using a special stripping and polishing process that use CMP and RCA techniques. This process improves particle performance and increases recycling time.

Metal Stripping is an effective way to reduce the cost of producing wafers. Aside from reducing costs, wafer reclaiming also improves the quality of these wafers. Unlike virgin wafers, reclaimed wafers have the best bulk properties and can be recycled up to three times.

Wafer reclaims services are increasingly being used in the manufacturing process of semiconductors. The demand for reclaimed services is increasing tremendously worldwide, largely driven by the increasing cost of virgin wafers. Another factor driving the growth of this industry is the huge advancement of technology.

Laser Cut down

If you own a laser cut-down business, it's important to know your target market. This will help you create a multifaceted marketing strategy. To reach your target market, consider television advertisements, billboards, and merchandise. You can also promote your business online, using social media. And of course, you must put your heart and soul into your business.

Laser cut-down services are often used in a variety of industries. These include aerospace, medical, automotive, semiconductor, and electrical industries. These services are highly accurate and can be performed in both low and high volumes. Some companies offer additional services, such as packaging, crating, and shipping. These companies have the necessary accreditation to ensure the quality of their products.

A laser company can provide a warranty for the products it sells. This warranty covers a product's materials and workmanship. However, it is not liable for injuries or damages arising from a mechanical defect. Therefore, if an item fails to meet your specifications, you must contact the manufacturer to have it fixed. If a laser service fails to meet your expectations, it is important to consult with a qualified laser service provider.

Laser Marking / Scribe

If you need to create unique designs on silicon wafers, laser marking is the perfect solution. This method is safe for the environment and doesn't use any chemicals or inks. This process uses a laser to create a permanent mark that is just below the surface. It will never fade and will not affect the silicon wafer's structure.

A laser engraving machine is composed of two parts: the laser and the controller. The laser is the drawing tool, and the controller controls how the beam moves and spreads. The surface must be the right material for the laser. It should match the material being etched, in order to get the best results.

The laser scribe is one of the newer dies separation methods. It uses a high-power laser to create a groove in the surface, which serves as a broken line. Another common method of die separation is wet sawing, which involves cutting the substrates with a high-speed circular diamond saw. The laser is often used for the cutting of substrates, but it can also create a slurry that is hazardous to workers.

Edge Profile Rounding/Grinding

Edge Profile Rounding/Grinding is an important part of the manufacturing process of silicon and other crystalline materials. The process creates a smooth edge and reduces the possibility of slipping. It uses a diamond wheel to adjust the diameter and orientation of the wafer. The T/3 template describes the acceptable edge profile for silicon wafers. The green zone represents the acceptable edge outline. The standard edge profile created by MPE always satisfies the T/3 template.

WATOM services help to ensure the accuracy of wafer edge profiles. These services enable you to determine the edge profile of any wafer. Furthermore, WATOM can measure the diameter and crystal orientation mark. It has a high measurement accuracy and can measure more than 50 wafers per hour.

Once a wafer has been processed, it is then sent for edge profile rounding/grinding. The process is completed in the appropriate chamber and cooled with an appropriate liquid. The resulting wafers are then ready for packaging in dies.

Lapping

The global silicon wafer reclaim market is poised for growth, and major players in this market are actively pursuing growth through mergers and acquisitions, new product launches, and joint ventures. Moreover, the rising demand for low-cost consumer electronics is creating a strong demand for silicon wafers in the global market. Furthermore, the advancement in technology is fueling the growth of this market.

Wafer reprocessing, or lapping, is a mechanical process used to remove excess silicon from wafer surfaces. The finished product has a dull, semi-reflective appearance and is free from defects. The lapping process requires specialized equipment to remove unwanted substances from a wafer's surface. The equipment used is equipped to perform single and double-sided lapping, and can be customized to meet the needs of a variety of applications.

Companies offering wafer reclaim services include MicroTech Systems, Inc., Phoenix Silicon International Corporation, and Shinryo Corporation. The process also involves sorting, stripping, and polishing.

Caustic Etching

Caustic etching involves removing a layer of silicon from a wafer. Different types of etching formulations are used in this process. Two basic types are acid etching and caustic etching. The former involves the use of hydrofluoric acid or nitric acid in the water, while the latter utilizes alkali metal hydroxides.

Silicon wafers produced by this process must have good surface uniformity throughout and low roughness. To achieve this, an additive is added to the caustic etchant. Most often, isopropanol is added. This additive helps to reduce roughness but is not advisable for use at high temperatures.

A modified recirculation method is another method that is suitable for using the additive in the etching process. It saturates the solution through contact with a solid iodate in an external loop. This enables periodic exposure of the etching solution.

Polishing SSP/DSP

Wafer polishing is a process that removes a variety of material films from silicon wafers. The process can be customized to remove specific material films and leave the bare wafer. However, over-stripping a wafer in an acid bath can lead to a rough surface, requiring additional polishing steps. This is an issue that can be avoided by choosing a reclaim vendor who has experience tailoring a stripping solution for specific chemistry.

Reclaiming silicon wafers for reuse involves a number of different processes. The first step is a thorough inspection of the wafer. This involves sorting it by thickness, type, resistivity, and other factors. Once sorted, the wafers go through etching and lapping. The second step is repolishing. Polishing can take place on either the backside or both sides of the wafer. Double-sided polishing is particularly useful for wafers with high flatness requirements.

The next step is to polish the reclaimed wafers for reuse. The polishing process involves removing the unwanted material from the silicon wafer. The process is done by combining wet and dry techniques, and then polishing and cleaning the reclaimed wafers to bring back the original silicon surface.