To achieve the best results, you must select the right Wafer Reclaiming Services provider. The right service provider should be able to meet the specifications of the semiconductor device manufacturer. The quality of their systems and tools will play a big role in the overall quality of the finished product. Moreover, the provider should be able to meet the "customer equivalent or better" technology requirements.


Wafer reclaiming is a process where a semiconductor manufacturer can reuse a refurbished wafer after it has been processed. This process is often performed on monitor or dummy wafers, rather than a defective wafer. This process reduces the running costs of a semiconductor manufacturing factory. There is a variety of reclaiming systems, as well as categories of reclaimed wafers.

A common type of reclaimed wafer is gallium arsenide. It is used in the manufacturing of digital and linear integrated circuits. Reclaiming a used wafer can provide significant cost savings and help to extend the life of a wafer. A wide range of processes are available for reclaiming wafers, and the process of lapping is one of them.


The process of wafer reclaiming involves removing surface scratches and thin films from a wafer. This process is often performed after the wafer has been processed through several steps. Then, a series of polishing steps are performed to restore the surface to its prime condition. Typically, the wafer is cleaned, rinsed with ultra-pure deionized water, and dried using proprietary techniques. Once the polishing process is complete, the wafer is checked for cleanliness and surface flatness using state-of-the-art metrology tools. Final processing and packaging of the wafer follow in a Class 1 cleanroom.

Wafer reclaiming service providers are also developing new specifications for 300-mm wafer polishing and cleaning. These companies are working closely with semiconductor device manufacturers to develop specifications that will improve the polishing process.


Wafer reclaiming services are a great way to save money by reusing silicon wafers. The process of reclaiming involves a combination of wet and dry processes to clean, polish, and restore the silicon surface. The result is a clean and usable silicon substrate.

Before beginning the reclaiming process, the wafers must be sorted. This step helps to prevent contamination of the reclaim line with metallic materials. This process typically involves visual inspection and the determination of wafer type. In addition, silicon wafers undergo measurements of dopant and mechanical parameters

The reclaiming process starts with a process known as lapping. This removes excess silicon from the wafer's surface. Depending on the condition of the wafer, this step may involve wet immersion batch tanks. In these tanks, chemicals are added to remove metal residues. Additional pre-treatment is usually required for high-quality silicon wafers coming from the reclaiming industry. After stripping, the wafers undergo a grinding process. This step is similar to CMP and removes SOI films. Afterward, wafers are smoothed and polished to create a uniform appearance.

Final Inspection

In the semiconductor manufacturing industry, the silicon wafer is one of the most critical materials. Reclaiming dummy and monitor wafers is one way to reduce the costs of new wafer manufacturing. However, these reclaimed wafers may contain defects. Some defects can be repaired by repolishing, while others cannot. Therefore, it is important to ensure the quality of the reclaimed wafers by conducting a final inspection.

The quality of the wafer reclaiming process is dependent on the tools and systems used. For this reason, it is important to check the capabilities of the wafer reclaiming service provider and whether they meet the quality requirements set by semiconductor device manufacturers.

Final Quality Assurance Documentation

Wafer reclaiming is a process that involves removing the surface and subsurface layers of a semiconductor wafer. This process is necessary because used wafers have a variety of surface structures. Some have multiple film layers on their surface, while others have been rejected during the manufacturing process. Once the reclaiming process is complete, the wafers are finished and undergo final quality inspection.

Quality assurance processes can be automated to minimize costs and speed up production. Automation can also help identify risks and potential errors before a product reaches the market. These proactive actions can prevent errors from occurring in future production.

Thin Wafer Processing - What Are the Main Factors That Affect the Final Film Thickness?

Several technologies are used in the Thin Wafer Processing process. These include Electrostatic polarization, Mechanical thinning, Spin-coating, and Laser dicing. These methods use silicon wafers that are as thin as 100um. However, it's important to note that these thin silicon wafers are very fragile and can be easily damaged.

Electrostatic polarization

Electrostatic polarization is a technique for preparing a silicon thin wafer by charging it with a charge on a carrier substrate. The carrier substrate can be made of silicon and patterned using thin-film technology. The carrier is electrically insulated and electrodes are formed on either the front or reverse side. This technology is ideal for thin wafer processing, as the carrier can withstand high temperatures.

The amount of polarization produced depends on the intensity of the electrical field, the voltage, and the distance between the polarization point and the electrode. This process is extremely slow and results in a continuous change in the output.

Mechanical Thinning

Mechanical thinning is a common technique used for thin wafer processing. It is a two-step process, with coarse grinding at a rate of 5 um/sec followed by fine grinding at a rate of 1 um/sec. The second step removes the layer containing the most damage and reduces the surface roughness. X-ray topography and interference contrast microscopy have both revealed that the first step leads to the highest amount of damage, which is about 20 um deep.

There are many different mechanical thinning techniques available for achieving the desired thickness. In the conventional method, diamond and resin-bonded grind wheels are used with a high-speed spindle. The spindle speeds are controlled by a grind recipe, which controls the rate at which material is removed. Depending on the desired final thickness, this process can be used to achieve ultra-thin wafers.


Spin-coating a thin wafer is a complex process with numerous factors influencing the final film thickness. These factors include spin speed, acceleration, solvent evaporation, and spin time. These parameters all contribute to the final film thickness and are highly dependent on each other. For the spin-coating process to be effective, it is essential to understand the fundamental physical principles behind this process. Here are the main factors that affect the final film thickness:

First, spin coating works by dispensing the photoresist onto the substrate in the center. This is done by spinning the substrate at high speeds, typically 500-4000 rpm. The dispense rate is a critical parameter because it can either cause the coating to ball up at the edges or result in a flat dome profile.

Laser Dicing

Laser dicing is a process in thin-wafer processing where a laser is used to deliver high-concentration photon streams onto the wafer and create a localized high-temperature region. The heat from the laser creates voids in the material, which are then removed. The heat generated also causes the dicing lane to tear apart, resulting in a weakened area.

Laser dicing can be used on a variety of wafer materials, but the smallest wafers can be as small as a 300-mm diameter. Laser full-cut dicing has the potential to greatly improve UPH and processing speed. Laser dicing is compatible with backside metal film (BMF) attached Silicon wafers, as well as GaP wafers. A fully automatic laser saw is one example of a high-throughput system for dicing. It has a high-performance laser head and a high-efficiency optical system.

Plasma Dicing

Plasma dicing is a fast and efficient technique for slicing thin wafers into chips. Unlike laser or blade dicing, which requires multiple passes, plasma dicing eliminates all dicing lanes at once. This allows manufacturers to produce smaller chips at high speeds. Moreover, plasma dicing is ideal for processing inertial sensors, which consist of tiny movable structures.

Plasma dicing holds great promise because it is a non-contact, low-temperature, and low-stress process. However, plasma dicing is still far from perfect. In some cases, bubbles or a bad reaction to the masking process can lead to an arc in the chamber, reducing yield.

Film Frames

Film frames for thin wafer processing are used to support semiconductor wafers during processing. They are generally annular in shape with a bottom surface of 58 and an inner edge of 52. The bottom surface has a tape 64 that is adhered to the semiconductor wafer 10. In addition, the top and bottom surfaces of film frames have two flats 60 on opposite sides and two positioning notches 62 for receiving guide pins.

Film frames for thin wafer processing can be made of porous ceramic or other material that allows for a uniform distribution of vacuum sources across the taped surface. The film frames are usually mounted on a chuck.

Demand for Three-Dimensional Integrated Circuits

The semiconductor industry is exploring the potential of three-dimensional integrated circuits (DICs) in thin-wafer processing. The technology has the potential to significantly improve chip performance. Moreover, it allows the integration of heterogeneous materials and devices. However, the process has its own challenges.

The fabrication process of 3D ICs involves the use of different design methods and fabrication techniques. The resulting devices can integrate more electronic functionalities, including memory. In addition, the method also involves low joint volumes and thicknesses.